A consistent, automated stencil workflow can be the deciding factor between error‑prone production and high‑performance efficiency – especially with complex packages like BGAs, SOICs or fine‑pitch chips.
1. Efficient Stencil Preparation
The Stencil Area Editor in PCB‑Investigator lets you define precise zones, combine areas, and export everything as XML or lists – the foundation for stencil consistency.
Then, the Stencil Generator applies rule sets per package type (BGA, chips, etc.) and supports custom scripting – perfect for automated, company‑specific processes.
2. Rule-Based Automation
Switching from predefined templates to rule‑based stencil creation ensures reliable automation. Production and CAD insights are integrated through learning loops from actual manufacturing.
3. Comprehensive Stencil Analysis
Before production, every paste opening undergoes checks:
🔹 Aspect & Area Ratio: Pad size vs. stencil thickness to avoid insufficient paste.
🔹 Ball/Paste Type: Ensures solder ball size and roundness for even application.
🔹 Pin Gap: Prevents bridging by analyzing pad‑to‑pad distances.
🔹 Metal-in-Paste Volume: Verifies optimal metal content for reliable printing.
🔹 Squeegee Direction & Drill Checks: Controls pressure direction and avoids paste loss through holes.
A well‑constructed stencil workflow with Area Editor, Generator, and robust analysis guarantees:
🔹 Consistent, automated processes
🔹 Rule‑based quality assurance
🔹 Early detection of potential defects
👉 Ready to take your manufacturing to the next level? Try the stencil workflow in PCB‑Investigator – your SMD paste printing process will thank you.
Test for free: https://www.pcb-investigator.com/download/
