New Release – V10

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In more than 10 years of successful company history, we have always developed our software with a view to progressiveness and process optimization.

Our goal then and now is to offer the greatest possible benefit to our customers while always staying one step ahead of current technological developments. Never out of focus is the easiest usability of our PCB-Investigator!

A milestone of this technological development is the simulation and analysis tool PCB-Investigator Physics. With version 10, the possibilities here have been expanded exponentially. PCB-Investigator Physics now offers the possibility to simulate time-dependent thermal simulations with several different operating states. Thanks to the extremely powerful GPU solver, such a transient simulation takes only a few minutes.

In the following now a list of all innovations and extensions of the V10:


  • Panel Nesting
  • PCB-Investigator now offers the option of using a so-called nesting algorithm to achieve the best placement in order to optimally utilize the panel area.
  • 3D Stack-Up Preview
  • The layer structure of the loaded design is displayed in a small three-dimensional preview window.
  • Inverse display of negative layers optionally available
  • Negative layers can now also be drawn inverted to see what really is produced.
  • New look of the layer list
  • The appearance of the layer list has been revised.
  • Various improvements in panel builder
  • For example, fiducials and drills can now also be set automatically in the panel.
  • More comfort when editing symbols in the internal symbol list
  • Existing “Embedded Designs” can now be read directly via the import menu


  • IPC356 Import
    Import components, pins and holes from IPC356 files.
  • 3D STEP Export [Example]
    The export of 3D Step models of the PCB has been further improved and now offers even more setup options.
  • Import of step models of components in the 3D view
    With the integrated 3D view of the PCB, step files can now be integrated in addition to OBJ files for a realistic representation of the components.
  • 3D-PDF Export [Example]
    It is now possible to export the printed circuit board into a 3D-PDF.
  • WebGL Export [Example]
    The output of an interactive 3D HTML file (WebGL) is now also possible.

Physics Edition

  • New tool: Ohmmeter
    In the Physics Edition, it is now possible to determine network resistances and voltage drops from any point to any point within a network. [Details]
  • Transient simulation with operational states
    Thermal simulations can now be carried out time-dependently and with different operating states. Thus, the heating and/or cooling of the printed circuit board can be determined in detail. [Details]
    The result can be documented in an interactive HTML file. [Example]

Programming interface (API)

  • API access via threads has been enormously improved
    The thread security when using the programming interface has been extremely increased.
  • API extensions to e.g. better set/query properties.
  • Errors and warnings are increasingly issued with warning / error codes.
  • Interfaces for unit tests on most classes.