Catch capacitive imbalance before it becomes a board spinIn high-speed PCB design, signal integrity is not only about routing rules and impedance targets. The capacitive relationship between a trace and…
Catch AOI issues before production exposes themIn PCB development, the real question is not whether a design looks correct, but whether it can actually be inspected in production. With Automated…
Maximum test coverage at a glanceHow confident are you that your assembly is truly tested? The Test Coverage Report in PCB-Investigator turns test data into an immediate visual overview, showing…
See thermal risk before the first prototypeIn PCB design, the most expensive problems are often the ones you only discover after fabrication. Local overheating, excessive current density, or unacceptable voltage…
Keep impedance under control in high-speed PCB designsAs data rates rise and edge speeds get faster, controlled impedance becomes a design constraint rather than a nice-to-have. Even small deviations in…
Why geometry quality defines the value of PCB analysisMany PCB analyses depend entirely on the quality of the underlying geometric data. In practice, CAD packages are often oversized, inconsistently modeled,…
Why BOM verification matters before production startsIn PCB assembly, BOM quality is not just an administrative task. A small mismatch between AVL data, CAD information, and the actual component set…
Catch capacitive imbalance before it affects the busIn high-speed PCB design, small geometric changes can have a big electrical impact. Even a local break in ground referencing can create uneven…
Evaluate capacitance early in the layoutIn high-frequency PCB design, signal quality is influenced not only by impedance but also by the capacitance to the reference plane. On DDR4, USB, LVDS,…
Catch thermal issues before the prototype stageIn PCB development, thermal problems often surface too late—after layout is finalized, during bring-up, or once the first prototype is already on the bench.…