{"id":301,"date":"2022-10-10T12:53:09","date_gmt":"2022-10-10T10:53:09","guid":{"rendered":"http:\/\/test.pcbinvestigator.de\/en\/?page_id=301"},"modified":"2025-09-10T15:29:18","modified_gmt":"2025-09-10T13:29:18","slug":"tombstone-dfm-analysis","status":"publish","type":"page","link":"https:\/\/www.pcb-investigator.com\/en\/features\/fabrication-tools\/tombstone-dfm-analysis\/","title":{"rendered":"Tombstone Analysis"},"content":{"rendered":"\n<figure class=\"wp-block-table edition-table is-style-stripes\" style=\"font-size:14px\"><table class=\"has-black-color has-text-color has-fixed-layout\"><tbody><tr><td class=\"has-text-align-center\" data-align=\"center\"><strong><a href=\"https:\/\/www.pcb-investigator.com\/en\/pcb-investigator\/basic\/\" data-type=\"page\" data-id=\"27\">BASIC<\/a><\/strong><\/td><td class=\"has-text-align-center\" data-align=\"center\"><strong><a href=\"https:\/\/www.pcb-investigator.com\/en\/pcb-investigator\/ultimate\/\" data-type=\"page\" data-id=\"29\">ULTIMATE<\/a><\/strong><\/td><td class=\"has-text-align-center\" data-align=\"center\"><strong><a href=\"https:\/\/www.pcb-investigator.com\/en\/pcb-investigator\/fabrication\/\" data-type=\"page\" data-id=\"31\">FABRICATION<\/a><\/strong><\/td><td class=\"has-text-align-center\" data-align=\"center\"><strong><a href=\"https:\/\/www.pcb-investigator.com\/en\/pcb-investigator\/production-control\/\" data-type=\"page\" data-id=\"34\">PRODUCTION CONTROL<\/a><\/strong><\/td><td class=\"has-text-align-center\" data-align=\"center\"><strong><a href=\"https:\/\/www.pcb-investigator.com\/en\/pcb-investigator\/developer\/\" data-type=\"page\" data-id=\"36\">DEVELOPER<\/a><\/strong><\/td><td class=\"has-text-align-center\" data-align=\"center\"><strong><a href=\"https:\/\/www.pcb-investigator.com\/en\/pcb-investigator\/physics\/\" data-type=\"page\" data-id=\"38\">PHYSICS<\/a><\/strong><\/td><\/tr><tr><td class=\"has-text-align-center\" data-align=\"center\"><\/td><td class=\"has-text-align-center\" data-align=\"center\">\u2713<\/td><td class=\"has-text-align-center\" data-align=\"center\">\u2713<\/td><td class=\"has-text-align-center\" data-align=\"center\">\u2713<\/td><td class=\"has-text-align-center\" data-align=\"center\">\u2713<\/td><td class=\"has-text-align-center\" data-align=\"center\">\u2713<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h2 class=\"wp-block-heading has-text-align-center has-text-color\" style=\"color:#636568;font-size:16px\">Helpful Hazard analysis with our tombstone DFM Analysis Plugin!<\/h2>\n\n\n\n<div class=\"wp-block-media-text is-stacked-on-mobile\" style=\"grid-template-columns:42% auto\"><figure class=\"wp-block-media-text__media\"><img loading=\"lazy\" decoding=\"async\" width=\"348\" height=\"210\" src=\"https:\/\/www.pcb-investigator.com\/en\/wp-content\/uploads\/sites\/3\/2023\/02\/tombstone.jpg\" alt=\"\" class=\"wp-image-2805 size-full\" srcset=\"https:\/\/www.pcb-investigator.com\/en\/wp-content\/uploads\/sites\/3\/2023\/02\/tombstone.jpg 348w, https:\/\/www.pcb-investigator.com\/en\/wp-content\/uploads\/sites\/3\/2023\/02\/tombstone-300x181.jpg 300w\" sizes=\"auto, (max-width: 348px) 100vw, 348px\" \/><\/figure><div class=\"wp-block-media-text__content\">\n<p><strong>The tombstone effect<\/strong> describes a phenomenon where small smt components (like resistors or capacitors) are partially or completely lifted from one of its copper pads (looking like a tombestone in a cemetery) during reflow soldering. Our&nbsp;<strong>Tombstone DFM Analysis Plug-in<\/strong>&nbsp;helps to avoid this issue by providing a detailed analysis of hazard areas.<\/p>\n<\/div><\/div>\n\n\n\n<div style=\"height:11px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<p><em><strong>Possible hazard areas are small components with two pins<\/strong><\/em>. In case the distance from one pin connection to the other is too big, the component might be tipped upright during the soldering process.<\/p>\n\n\n\n<p>To avoid this, the plug-in provides a list of all components with differences in their pin connections. This list includes the difference in percent and absolute numbers, the mounting side and the component package name.<\/p>\n\n\n\n<p>Of course the results can be exported to an <strong><em>Excel CSV or TXT file <\/em><\/strong>and beginning with Version 9 there will also a <strong><em>HTML Export.<\/em><\/strong><\/p>\n\n\n\n<p>There is also a overview diagram with danger level depending on the difference of heat dissipation.<\/p>\n\n\n\n<div class=\"wp-block-group\"><div class=\"wp-block-group__inner-container is-layout-flow wp-block-group-is-layout-flow\">\n<div style=\"height:20px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<figure class=\"wp-block-gallery has-nested-images columns-4 is-cropped wp-block-gallery-1 is-layout-flex wp-block-gallery-is-layout-flex\">\n<figure class=\"wp-block-image size-large\"><a href=\"https:\/\/www.pcb-investigator.com\/wp-content\/uploads\/2022\/09\/heatDissipationPCBItombstone.png\"><img decoding=\"async\" data-id=\"1033\" src=\"https:\/\/www.pcb-investigator.com\/wp-content\/uploads\/2022\/09\/heatDissipationPCBItombstone.png\" alt=\"\" class=\"wp-image-1033\"\/><\/a><\/figure>\n\n\n\n<figure class=\"wp-block-image size-large\"><a href=\"https:\/\/www.pcb-investigator.com\/wp-content\/uploads\/2022\/09\/Tombstone_DFM_Analysis_2.jpg\"><img decoding=\"async\" data-id=\"1034\" src=\"https:\/\/www.pcb-investigator.com\/wp-content\/uploads\/2022\/09\/Tombstone_DFM_Analysis_2.jpg\" alt=\"\" class=\"wp-image-1034\"\/><\/a><\/figure>\n\n\n\n<figure class=\"wp-block-image size-large\"><a href=\"https:\/\/www.pcb-investigator.com\/wp-content\/uploads\/2022\/09\/Tombstone_DFM_Analysis_3.jpg\"><img decoding=\"async\" data-id=\"1035\" src=\"https:\/\/www.pcb-investigator.com\/wp-content\/uploads\/2022\/09\/Tombstone_DFM_Analysis_3.jpg\" alt=\"\" class=\"wp-image-1035\"\/><\/a><\/figure>\n\n\n\n<figure class=\"wp-block-image size-large\"><a href=\"https:\/\/www.pcb-investigator.com\/wp-content\/uploads\/2022\/09\/Tombstone_DFM_Analysis_4.jpg\"><img decoding=\"async\" data-id=\"1036\" src=\"https:\/\/www.pcb-investigator.com\/wp-content\/uploads\/2022\/09\/Tombstone_DFM_Analysis_4.jpg\" alt=\"\" class=\"wp-image-1036\"\/><\/a><\/figure>\n<\/figure>\n\n\n\n<div style=\"height:40px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<div class=\"wp-block-buttons is-layout-flex wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button has-custom-width wp-block-button__width-100\"><a class=\"wp-block-button__link has-text-color has-background\" href=\"https:\/\/www.pcb-investigator.com\/en\/download-pcb-investigator\/\" style=\"border-radius:5px;background-color:#eaebef;color:#252d5c\">Download PCB-Investigator with all plug-ins for free testing &gt;&gt;<\/a><\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-group\"><div class=\"wp-block-group__inner-container is-layout-flow wp-block-group-is-layout-flow\">\n<div style=\"height:60px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<p style=\"font-size:17px\"><strong><mark style=\"background-color:#abb8c3\" class=\"has-inline-color\">Downloads\/Links<\/mark><\/strong><\/p>\n<\/div><\/div>\n\n\n\n<p><a href=\"https:\/\/manual.pcb-investigator.com\/pages\/tombstone_analysis\" target=\"_blank\" rel=\"noreferrer noopener\">\u00bb PCBI Manual | Tombstone Analysis <\/a><\/p>\n<\/div><\/div>\n","protected":false},"excerpt":{"rendered":"<p>BASIC ULTIMATE FABRICATION PRODUCTION CONTROL DEVELOPER PHYSICS \u2713 \u2713 \u2713 \u2713 \u2713 Helpful Hazard analysis with our tombstone DFM Analysis Plugin! The tombstone effect describes a phenomenon where small smt components (like resistors or capacitors) are partially or completely lifted from one of its copper pads (looking like a tombestone in a cemetery) during reflow [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":257,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"categories":[],"tags":[66,59,55,60,17,61,57,54],"class_list":["post-301","page","type-page","status-publish","hentry","tag-analysis","tag-components","tag-developer","tag-fabrication","tag-physics","tag-production-control","tag-report","tag-ultimate","entry"],"_links":{"self":[{"href":"https:\/\/www.pcb-investigator.com\/en\/wp-json\/wp\/v2\/pages\/301","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.pcb-investigator.com\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.pcb-investigator.com\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.pcb-investigator.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.pcb-investigator.com\/en\/wp-json\/wp\/v2\/comments?post=301"}],"version-history":[{"count":11,"href":"https:\/\/www.pcb-investigator.com\/en\/wp-json\/wp\/v2\/pages\/301\/revisions"}],"predecessor-version":[{"id":3399,"href":"https:\/\/www.pcb-investigator.com\/en\/wp-json\/wp\/v2\/pages\/301\/revisions\/3399"}],"up":[{"embeddable":true,"href":"https:\/\/www.pcb-investigator.com\/en\/wp-json\/wp\/v2\/pages\/257"}],"wp:attachment":[{"href":"https:\/\/www.pcb-investigator.com\/en\/wp-json\/wp\/v2\/media?parent=301"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.pcb-investigator.com\/en\/wp-json\/wp\/v2\/categories?post=301"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.pcb-investigator.com\/en\/wp-json\/wp\/v2\/tags?post=301"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}