A consistent, automated stencil workflow can be the deciding factor between error\u2011prone production and high\u2011performance efficiency \u2013 especially with complex packages like BGAs, SOICs or fine\u2011pitch chips.<\/p>\n\n\n\n
1. Efficient Stencil Preparation<\/strong><\/p>\n\n\n\n The Stencil Area Editor<\/strong> in PCB\u2011Investigator lets you define precise zones, combine areas, and export everything as XML or lists \u2013 the foundation for stencil consistency. 2. Rule-Based Automation<\/strong><\/p>\n\n\n\n Switching from predefined templates to rule\u2011based stencil creation ensures reliable automation. Production and CAD insights are integrated through learning loops from actual manufacturing.<\/p>\n\n\n\n 3. Comprehensive Stencil Analysis<\/strong><\/p>\n\n\n\n Before production, every paste opening undergoes checks:<\/p>\n\n\n\n \ud83d\udd39<\/strong> Aspect & Area Ratio<\/strong>: Pad size vs. stencil thickness to avoid insufficient paste.<\/p>\n\n\n\n \ud83d\udd39<\/strong> Ball\/Paste Type<\/strong>: Ensures solder ball size and roundness for even application.<\/p>\n\n\n\n \ud83d\udd39<\/strong> Pin Gap<\/strong>: Prevents bridging by analyzing pad\u2011to\u2011pad distances.<\/p>\n\n\n\n \ud83d\udd39<\/strong> Metal-in-Paste Volume<\/strong>: Verifies optimal metal content for reliable printing.<\/p>\n\n\n\n \ud83d\udd39<\/strong> Squeegee Direction & Drill Checks<\/strong>: Controls pressure direction and avoids paste loss through holes.<\/p>\n<\/div>\n\n\n\n A well\u2011constructed stencil workflow with Area Editor, Generator, and robust analysis guarantees:
Then, the Stencil Generator<\/strong> applies rule sets per package type (BGA, chips, etc.) and supports custom scripting \u2013 perfect for automated, company\u2011specific processes.<\/p>\n\n\n\n
\ud83d\udd39<\/strong> <\/strong>Consistent, automated processes
\ud83d\udd39<\/strong> <\/strong>Rule\u2011based quality assurance
\ud83d\udd39<\/strong> <\/strong>Early detection of potential defects<\/p>\n\n\n\n