1. top_layer (36µm / Copper$PCBI)
2. prepreg_1 (1504µm / FR4$PCBI)
3. bottom_layer (36µm / Copper$PCBI)
4. drill (18µm / Copper$PCBI)

1.57 seconds

1. COMP_+_TOP @ 1.57 seconds

   

   Min Value:	20.00 °C
   Max Value:	23.46 °C
   Layer:	COMP_+_TOP
   Height:	-
   Material:	-

2. TOP_LAYER @ 1.57 seconds

   

   Min Value:	20.00 °C
   Max Value:	23.23 °C
   Layer:	TOP_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

3. PREPREG_1 @ 1.57 seconds

   

   Min Value:	20.00 °C
   Max Value:	22.00 °C
   Layer:	PREPREG_1
   Height:	1504 µm
   Material:	FR4$PCBI

4. BOTTOM_LAYER @ 1.57 seconds

   

   Min Value:	20.00 °C
   Max Value:	21.75 °C
   Layer:	BOTTOM_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

5. COMP_+_BOT @ 1.57 seconds

   

   Min Value:	20.00 °C
   Max Value:	20.00 °C
   Layer:	COMP_+_BOT
   Height:	-
   Material:	-

3.61 seconds

1. COMP_+_TOP @ 3.61 seconds

   

   Min Value:	20.00 °C
   Max Value:	26.34 °C
   Layer:	COMP_+_TOP
   Height:	-
   Material:	-

2. TOP_LAYER @ 3.61 seconds

   

   Min Value:	20.00 °C
   Max Value:	26.03 °C
   Layer:	TOP_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

3. PREPREG_1 @ 3.61 seconds

   

   Min Value:	20.00 °C
   Max Value:	24.35 °C
   Layer:	PREPREG_1
   Height:	1504 µm
   Material:	FR4$PCBI

4. BOTTOM_LAYER @ 3.61 seconds

   

   Min Value:	20.00 °C
   Max Value:	23.96 °C
   Layer:	BOTTOM_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

5. COMP_+_BOT @ 3.61 seconds

   

   Min Value:	20.00 °C
   Max Value:	20.00 °C
   Layer:	COMP_+_BOT
   Height:	-
   Material:	-

6.26 seconds

1. COMP_+_TOP @ 6.26 seconds

   

   Min Value:	20.00 °C
   Max Value:	29.12 °C
   Layer:	COMP_+_TOP
   Height:	-
   Material:	-

2. TOP_LAYER @ 6.26 seconds

   

   Min Value:	20.00 °C
   Max Value:	28.78 °C
   Layer:	TOP_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

3. PREPREG_1 @ 6.26 seconds

   

   Min Value:	20.00 °C
   Max Value:	26.93 °C
   Layer:	PREPREG_1
   Height:	1504 µm
   Material:	FR4$PCBI

4. BOTTOM_LAYER @ 6.26 seconds

   

   Min Value:	20.00 °C
   Max Value:	26.46 °C
   Layer:	BOTTOM_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

5. COMP_+_BOT @ 6.26 seconds

   

   Min Value:	20.00 °C
   Max Value:	20.00 °C
   Layer:	COMP_+_BOT
   Height:	-
   Material:	-

9.70 seconds

1. COMP_+_TOP @ 9.70 seconds

   

   Min Value:	20.00 °C
   Max Value:	32.05 °C
   Layer:	COMP_+_TOP
   Height:	-
   Material:	-

2. TOP_LAYER @ 9.70 seconds

   

   Min Value:	20.00 °C
   Max Value:	31.69 °C
   Layer:	TOP_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

3. PREPREG_1 @ 9.70 seconds

   

   Min Value:	20.00 °C
   Max Value:	29.76 °C
   Layer:	PREPREG_1
   Height:	1504 µm
   Material:	FR4$PCBI

4. BOTTOM_LAYER @ 9.70 seconds

   

   Min Value:	20.00 °C
   Max Value:	29.24 °C
   Layer:	BOTTOM_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

5. COMP_+_BOT @ 9.70 seconds

   

   Min Value:	20.00 °C
   Max Value:	20.00 °C
   Layer:	COMP_+_BOT
   Height:	-
   Material:	-

14.18 seconds

1. COMP_+_TOP @ 14.18 seconds

   

   Min Value:	20.00 °C
   Max Value:	35.24 °C
   Layer:	COMP_+_TOP
   Height:	-
   Material:	-

2. TOP_LAYER @ 14.18 seconds

   

   Min Value:	20.01 °C
   Max Value:	34.87 °C
   Layer:	TOP_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

3. PREPREG_1 @ 14.18 seconds

   

   Min Value:	20.01 °C
   Max Value:	32.92 °C
   Layer:	PREPREG_1
   Height:	1504 µm
   Material:	FR4$PCBI

4. BOTTOM_LAYER @ 14.18 seconds

   

   Min Value:	20.01 °C
   Max Value:	32.37 °C
   Layer:	BOTTOM_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

5. COMP_+_BOT @ 14.18 seconds

   

   Min Value:	20.00 °C
   Max Value:	20.00 °C
   Layer:	COMP_+_BOT
   Height:	-
   Material:	-

20.00 seconds

1. COMP_+_TOP @ 20.00 seconds

   

   Min Value:	20.00 °C
   Max Value:	38.75 °C
   Layer:	COMP_+_TOP
   Height:	-
   Material:	-

2. TOP_LAYER @ 20.00 seconds

   

   Min Value:	20.02 °C
   Max Value:	38.37 °C
   Layer:	TOP_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

3. PREPREG_1 @ 20.00 seconds

   

   Min Value:	20.02 °C
   Max Value:	36.43 °C
   Layer:	PREPREG_1
   Height:	1504 µm
   Material:	FR4$PCBI

4. BOTTOM_LAYER @ 20.00 seconds

   

   Min Value:	20.02 °C
   Max Value:	35.85 °C
   Layer:	BOTTOM_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

5. COMP_+_BOT @ 20.00 seconds

   

   Min Value:	20.00 °C
   Max Value:	20.00 °C
   Layer:	COMP_+_BOT
   Height:	-
   Material:	-

21.57 seconds

1. COMP_+_TOP @ 21.57 seconds

   

   Min Value:	20.00 °C
   Max Value:	39.65 °C
   Layer:	COMP_+_TOP
   Height:	-
   Material:	-

2. TOP_LAYER @ 21.57 seconds

   

   Min Value:	20.04 °C
   Max Value:	39.26 °C
   Layer:	TOP_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

3. PREPREG_1 @ 21.57 seconds

   

   Min Value:	20.04 °C
   Max Value:	37.33 °C
   Layer:	PREPREG_1
   Height:	1504 µm
   Material:	FR4$PCBI

4. BOTTOM_LAYER @ 21.57 seconds

   

   Min Value:	20.05 °C
   Max Value:	36.74 °C
   Layer:	BOTTOM_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

5. COMP_+_BOT @ 21.57 seconds

   

   Min Value:	20.00 °C
   Max Value:	20.00 °C
   Layer:	COMP_+_BOT
   Height:	-
   Material:	-

23.61 seconds

1. COMP_+_TOP @ 23.61 seconds

   

   Min Value:	20.00 °C
   Max Value:	40.76 °C
   Layer:	COMP_+_TOP
   Height:	-
   Material:	-

2. TOP_LAYER @ 23.61 seconds

   

   Min Value:	20.05 °C
   Max Value:	40.36 °C
   Layer:	TOP_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

3. PREPREG_1 @ 23.61 seconds

   

   Min Value:	20.05 °C
   Max Value:	38.43 °C
   Layer:	PREPREG_1
   Height:	1504 µm
   Material:	FR4$PCBI

4. BOTTOM_LAYER @ 23.61 seconds

   

   Min Value:	20.06 °C
   Max Value:	37.84 °C
   Layer:	BOTTOM_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

5. COMP_+_BOT @ 23.61 seconds

   

   Min Value:	20.00 °C
   Max Value:	20.00 °C
   Layer:	COMP_+_BOT
   Height:	-
   Material:	-

26.26 seconds

1. COMP_+_TOP @ 26.26 seconds

   

   Min Value:	20.00 °C
   Max Value:	42.10 °C
   Layer:	COMP_+_TOP
   Height:	-
   Material:	-

2. TOP_LAYER @ 26.26 seconds

   

   Min Value:	20.06 °C
   Max Value:	41.69 °C
   Layer:	TOP_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

3. PREPREG_1 @ 26.26 seconds

   

   Min Value:	20.07 °C
   Max Value:	39.77 °C
   Layer:	PREPREG_1
   Height:	1504 µm
   Material:	FR4$PCBI

4. BOTTOM_LAYER @ 26.26 seconds

   

   Min Value:	20.08 °C
   Max Value:	39.18 °C
   Layer:	BOTTOM_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

5. COMP_+_BOT @ 26.26 seconds

   

   Min Value:	20.00 °C
   Max Value:	20.00 °C
   Layer:	COMP_+_BOT
   Height:	-
   Material:	-

29.70 seconds

1. COMP_+_TOP @ 29.70 seconds

   

   Min Value:	20.00 °C
   Max Value:	43.71 °C
   Layer:	COMP_+_TOP
   Height:	-
   Material:	-

2. TOP_LAYER @ 29.70 seconds

   

   Min Value:	20.08 °C
   Max Value:	43.29 °C
   Layer:	TOP_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

3. PREPREG_1 @ 29.70 seconds

   

   Min Value:	20.09 °C
   Max Value:	41.38 °C
   Layer:	PREPREG_1
   Height:	1504 µm
   Material:	FR4$PCBI

4. BOTTOM_LAYER @ 29.70 seconds

   

   Min Value:	20.11 °C
   Max Value:	40.78 °C
   Layer:	BOTTOM_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

5. COMP_+_BOT @ 29.70 seconds

   

   Min Value:	20.00 °C
   Max Value:	20.00 °C
   Layer:	COMP_+_BOT
   Height:	-
   Material:	-

34.18 seconds

1. COMP_+_TOP @ 34.18 seconds

   

   Min Value:	20.00 °C
   Max Value:	45.60 °C
   Layer:	COMP_+_TOP
   Height:	-
   Material:	-

2. TOP_LAYER @ 34.18 seconds

   

   Min Value:	20.10 °C
   Max Value:	45.18 °C
   Layer:	TOP_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

3. PREPREG_1 @ 34.18 seconds

   

   Min Value:	20.12 °C
   Max Value:	43.28 °C
   Layer:	PREPREG_1
   Height:	1504 µm
   Material:	FR4$PCBI

4. BOTTOM_LAYER @ 34.18 seconds

   

   Min Value:	20.15 °C
   Max Value:	42.66 °C
   Layer:	BOTTOM_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

5. COMP_+_BOT @ 34.18 seconds

   

   Min Value:	20.00 °C
   Max Value:	20.00 °C
   Layer:	COMP_+_BOT
   Height:	-
   Material:	-

40.00 seconds

1. COMP_+_TOP @ 40.00 seconds

   

   Min Value:	20.00 °C
   Max Value:	47.77 °C
   Layer:	COMP_+_TOP
   Height:	-
   Material:	-

2. TOP_LAYER @ 40.00 seconds

   

   Min Value:	20.15 °C
   Max Value:	47.34 °C
   Layer:	TOP_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

3. PREPREG_1 @ 40.00 seconds

   

   Min Value:	20.19 °C
   Max Value:	45.44 °C
   Layer:	PREPREG_1
   Height:	1504 µm
   Material:	FR4$PCBI

4. BOTTOM_LAYER @ 40.00 seconds

   

   Min Value:	20.23 °C
   Max Value:	44.82 °C
   Layer:	BOTTOM_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

5. COMP_+_BOT @ 40.00 seconds

   

   Min Value:	20.00 °C
   Max Value:	20.00 °C
   Layer:	COMP_+_BOT
   Height:	-
   Material:	-

40.78 seconds

1. COMP_+_TOP @ 40.78 seconds

   

   Min Value:	20.00 °C
   Max Value:	46.02 °C
   Layer:	COMP_+_TOP
   Height:	-
   Material:	-

2. TOP_LAYER @ 40.78 seconds

   

   Min Value:	20.16 °C
   Max Value:	45.72 °C
   Layer:	TOP_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

3. PREPREG_1 @ 40.78 seconds

   

   Min Value:	20.20 °C
   Max Value:	44.84 °C
   Layer:	PREPREG_1
   Height:	1504 µm
   Material:	FR4$PCBI

4. BOTTOM_LAYER @ 40.78 seconds

   

   Min Value:	20.22 °C
   Max Value:	44.30 °C
   Layer:	BOTTOM_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

5. COMP_+_BOT @ 40.78 seconds

   

   Min Value:	20.00 °C
   Max Value:	20.00 °C
   Layer:	COMP_+_BOT
   Height:	-
   Material:	-

41.80 seconds

1. COMP_+_TOP @ 41.80 seconds

   

   Min Value:	20.00 °C
   Max Value:	44.49 °C
   Layer:	COMP_+_TOP
   Height:	-
   Material:	-

2. TOP_LAYER @ 41.80 seconds

   

   Min Value:	20.16 °C
   Max Value:	44.26 °C
   Layer:	TOP_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

3. PREPREG_1 @ 41.80 seconds

   

   Min Value:	20.21 °C
   Max Value:	44.10 °C
   Layer:	PREPREG_1
   Height:	1504 µm
   Material:	FR4$PCBI

4. BOTTOM_LAYER @ 41.80 seconds

   

   Min Value:	20.21 °C
   Max Value:	43.48 °C
   Layer:	BOTTOM_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

5. COMP_+_BOT @ 41.80 seconds

   

   Min Value:	20.00 °C
   Max Value:	20.00 °C
   Layer:	COMP_+_BOT
   Height:	-
   Material:	-

43.12 seconds

1. COMP_+_TOP @ 43.12 seconds

   

   Min Value:	20.00 °C
   Max Value:	43.11 °C
   Layer:	COMP_+_TOP
   Height:	-
   Material:	-

2. TOP_LAYER @ 43.12 seconds

   

   Min Value:	20.17 °C
   Max Value:	42.93 °C
   Layer:	TOP_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

3. PREPREG_1 @ 43.12 seconds

   

   Min Value:	20.21 °C
   Max Value:	43.08 °C
   Layer:	PREPREG_1
   Height:	1504 µm
   Material:	FR4$PCBI

4. BOTTOM_LAYER @ 43.12 seconds

   

   Min Value:	20.22 °C
   Max Value:	42.51 °C
   Layer:	BOTTOM_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

5. COMP_+_BOT @ 43.12 seconds

   

   Min Value:	20.00 °C
   Max Value:	20.00 °C
   Layer:	COMP_+_BOT
   Height:	-
   Material:	-

44.84 seconds

1. COMP_+_TOP @ 44.84 seconds

   

   Min Value:	20.00 °C
   Max Value:	41.79 °C
   Layer:	COMP_+_TOP
   Height:	-
   Material:	-

2. TOP_LAYER @ 44.84 seconds

   

   Min Value:	20.19 °C
   Max Value:	41.65 °C
   Layer:	TOP_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

3. PREPREG_1 @ 44.84 seconds

   

   Min Value:	20.23 °C
   Max Value:	41.91 °C
   Layer:	PREPREG_1
   Height:	1504 µm
   Material:	FR4$PCBI

4. BOTTOM_LAYER @ 44.84 seconds

   

   Min Value:	20.23 °C
   Max Value:	41.42 °C
   Layer:	BOTTOM_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

5. COMP_+_BOT @ 44.84 seconds

   

   Min Value:	20.00 °C
   Max Value:	20.00 °C
   Layer:	COMP_+_BOT
   Height:	-
   Material:	-

47.08 seconds

1. COMP_+_TOP @ 47.08 seconds

   

   Min Value:	20.00 °C
   Max Value:	40.46 °C
   Layer:	COMP_+_TOP
   Height:	-
   Material:	-

2. TOP_LAYER @ 47.08 seconds

   

   Min Value:	20.21 °C
   Max Value:	40.34 °C
   Layer:	TOP_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

3. PREPREG_1 @ 47.08 seconds

   

   Min Value:	20.25 °C
   Max Value:	40.72 °C
   Layer:	PREPREG_1
   Height:	1504 µm
   Material:	FR4$PCBI

4. BOTTOM_LAYER @ 47.08 seconds

   

   Min Value:	20.25 °C
   Max Value:	40.22 °C
   Layer:	BOTTOM_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

5. COMP_+_BOT @ 47.08 seconds

   

   Min Value:	20.00 °C
   Max Value:	20.00 °C
   Layer:	COMP_+_BOT
   Height:	-
   Material:	-

50.00 seconds

1. COMP_+_TOP @ 50.00 seconds

   

   Min Value:	20.00 °C
   Max Value:	39.06 °C
   Layer:	COMP_+_TOP
   Height:	-
   Material:	-

2. TOP_LAYER @ 50.00 seconds

   

   Min Value:	20.23 °C
   Max Value:	38.97 °C
   Layer:	TOP_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

3. PREPREG_1 @ 50.00 seconds

   

   Min Value:	20.28 °C
   Max Value:	39.49 °C
   Layer:	PREPREG_1
   Height:	1504 µm
   Material:	FR4$PCBI

4. BOTTOM_LAYER @ 50.00 seconds

   

   Min Value:	20.28 °C
   Max Value:	38.90 °C
   Layer:	BOTTOM_LAYER
   Height:	36 µm
   Material:	Copper$PCBI

5. COMP_+_BOT @ 50.00 seconds

   

   Min Value:	20.00 °C
   Max Value:	20.00 °C
   Layer:	COMP_+_BOT
   Height:	-
   Material:	-