Project Info

Author: Juergen.Schill
Date: 14.10.2018 17:56:12
Design Path: d:\Demo\odb
Version: V 10 - Physics
Description: Channel 1+2 => 20s / Channel 1+3 => 20s / 10s cooldown
Data Step: pcb
Simulation Time: 10.71 min
Temperature Range: 20.00 °C - 47.77 °C
Simulation Settings
Ambient Temperature Top: 20 °C
Ambient Temperature Bottom: 20 °C
Heat Exchange Top: Free Convection (SurfaceEmissivity: 0.950)
Heat Exchange Bottom: Free Convection (SurfaceEmissivity: 0.950)
Accuracy: Standard
Raster Size: 100 µm
Rely on Net: Yes
Operating Temperature/Temperature Map: 20 °C
  1. top_layer (36µm / Copper$PCBI)
  2. prepreg_1 (1504µm / FR4$PCBI)
  3. bottom_layer (36µm / Copper$PCBI)
  4. drill (18µm / Copper$PCBI)

Result

Operation State: Channel 1+2
Component Power Loss
D5 0,3 W
D6 0,3 W
D7 0,3 W
D2 0,3 W
D3 0,3 W
D4 0,3 W
R2 0,1 W
R1 0,1 W
Q2 1,2 W
Q1 1,2 W
Net Current
NetC9_1 0.35 A
NetD5_2 0.35 A
NetD6_2 0.35 A
NetC3_1 0.35 A
NetD2_2 0.35 A
NetD3_2 0.35 A
VIN 0.70 A
NetQ2_4 0.35 A
NetQ1_4 0.35 A
NetD1_2 0.70 A
Operation State: Channel 1+3
Component Power Loss
D9 0,3 W
D10 0,3 W
D11 0,3 W
D2 0,3 W
D3 0,3 W
D4 0,3 W
R4 0,1 W
R1 0,1 W
Q3 1,2 W
Q1 1,2 W
Net Current
NetC13_1 0.70 A
NetD9_2 0.70 A
NetD10_2 0.70 A
NetC3_1 0.35 A
NetD2_2 0.35 A
NetD3_2 0.35 A
VIN 0.70 A
NetQ3_4 0.35 A
NetQ1_4 0.35 A
NetD1_2 0.70 A

Animated Heatmap