The tombstone effect is far from a marginal issue for experienced SMT and DFM teams. It occurs when the two pads of a 2‑pin component have thermally or geometrically asymmetric connections, resulting in uneven heat dissipation during the reflow process. The Tombstone DFM Analysis in PCB‑Investigator not only detects these risks but also quantifies the underlying pin‑connection differences.
Uneven copper connections—such as 100 µm on pin 1 versus 400 µm on pin 2—lead to measurable differences in cooling rates. These thermally induced stress gradients are the primary reason why components lift during the solder solidification phase. The analysis visualizes these differences with precision, making critical 2‑pin components clearly identifiable.
Using filters such as component size, properties, or minimum deviation thresholds, only the relevant components are selected. The result list provides all essential parameters including absolute and percentage differences, package type, and mounting side—offering a clear, reproducible view of the actual thermal imbalance.
Additionally, a danger‑level diagram visualizes the heat‑dissipation potential, making thermal asymmetries immediately visible and supporting well‑founded decisions on layout optimization or reflow‑profile adjustments.
With export options (CSV, TXT, HTML) and integration into the Extended Design Report, results can be documented reliably and shared across teams. In short: the Tombstone Analysis delivers a robust, data‑driven assessment of thermal imbalances—far beyond traditional DFM checks.
In short: the Tombstone Analysis in PCB‑Investigator provides a reliable, data‑driven assessment of thermal imbalances and sets new standards in securing SMT processes—far beyond traditional DFM checks.
