Detect tombstoning before it reaches the soldering line
The tombstone effect is one of those manufacturing issues that can quietly turn into costly rework. Small SMT components such as resistors and capacitors may partially or fully lift from one pad during reflow soldering, creating an open joint and an avoidable defect.
PCB-Investigator’s Tombstone DFM Analysis is designed to identify these risky cases early. The plugin focuses on small 2-pin components and evaluates the difference in pad connection between pin 1 and pin 2. When that imbalance becomes too large, the probability of uneven heating, mechanical stress, and tombstoning increases significantly.
From design review to actionable results
Rather than relying on a visual guess, the analysis generates a structured list of potential danger spots. Engineers can quickly see which components are at risk and why, with the relevant comparison data presented directly in the report.
Filtering options make the workflow practical for real-world boards. You can limit the analysis by component size, define a minimum connection-difference threshold, and decide whether vias should be counted in the evaluation.
Asymmetric thermal and electrical connection behavior is exactly the kind of issue DFM analysis should catch before production.
Detailed output that supports engineering decisions
The result list includes the component reference, package name, mounting side, and the connection difference in both percent and absolute values. For faster review, the plugin can also generate a danger-zone diagram that summarizes heat dissipation potential across the affected parts.
- Find critical small 2-pin SMT components early
- Measure pad-connection differences in detail
- Export results as Excel, TXT, or HTML report
- Save and reload analysis results for later use
- Reuse findings in the Extended Design Report
When the precision flag indicates a complex estimation, the component is clearly marked for closer review. That makes it easier to separate robust findings from cases that deserve a manual check.
Better manufacturability, fewer surprises
For PCB designers, manufacturing engineers, and technical decision-makers, the value is straightforward: earlier visibility, better design decisions, and fewer reflow surprises. Tombstoning is much easier to prevent in the DFM phase than to correct after assembly.
Try the Tombstone DFM Analysis in PCB-Investigator and check your next design for potential tombstone risks before it enters production.
